H10W 40/305
The fluid being a liquefied gas
Official title: {the fluid being a liquefied gas, e.g. liquid nitrogen}
H10W40/305 (The fluid being a liquefied gas) appears on 98 US grants and 60 published applications in this corpus.
Search patents in H10W- Granted patents
- 98
- Published applications
- 60
- Assignees
- 54
- Inventors
- 232
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 3 |
| 2004 | 4 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 2 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 0 | 2 |
| 2019 | 3 | 3 |
| 2020 | 7 | 10 |
| 2021 | 6 | 5 |
| 2022 | 3 | 4 |
| 2023 | 3 | 12 |
| 2024 | 3 | 7 |
| 2025 | 5 | 2 |
| 2026 | 6 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic components employing field ionization29 Sep 2026US 12,751,052 B2Psiquantum, Corp.
- Transistor-scale thermoelectric devices for refrigeration of integrated circuits11 Aug 2026US 12,707,971 B2Intel Corporation
- Co-integrated resonant tunneling diode and high-electron mobility transistor7 Jul 2026US 12,677,435 B2International Business Machines Corporation
- Transistor body-induced body leakage mitigation at low temperature2 Jun 2026US 12,648,175 B2Intel Corporation
- Domino logic circuitry with keeper transistors on backside of integrated circuit die19 May 2026US 12,633,921 B2Intel Corporation
- Cryogenic-compatible hermetic packing for superconducting quantum chips16 Jul 2026US 2026/0206638 A1IQM Finland Oy
- System including an ion trap device arranged on a substrate19 Jun 2025US 2025/0198686 A1Infineon Technologies Austria AG
- Refrigeration device and method27 Mar 2025US 2025/0102215 A1L Air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation des Procedes Georges Claude
- Ic package with very thin vapor chamber for heat dissipation26 Dec 2024US 2024/0429123 A1
- Superconducting magnetic shield for ion trap14 Nov 2024US 2024/0379257 A1Infineon Technologies Austria AG
Most cited
By later US patents
- Microchannel heat sink assembly166US 5,099,311 AThe United States of America as represented by the United States Department of Energy · 1992
- Convection transfer system120US 5,310,440 AInternational Business Machines Corporation · 1994
- Convection transfer system84US 5,265,670 AInternational Business Machines Corporation · 1993
- Ceramic card assembly having enhanced power distribution and cooling81US 4,771,366 AInternational Business Machines Corporation · 1988
- Apparatus and method for cooling an electronic device57US 4,866,570 ANCR Corporation · 1989