Back to results
US 12,684,734 B2Granted
Immersion cooling system for integrated circuit
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJen-Yuan Chang
Life of this patent
Estimating the term…
Abstract
Cooling systems for integrated circuit devices are provided. A cooling system according to the present disclosure includes a coolant tank containing a coolant, a cooling coil disposed within the coolant tank, a refrigerant circulating in the cooling coil, and a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank.
Claims20
A cooling system, comprising:
- a coolant tank containing a coolant;
- a reservoir in fluid communication with the coolant tank via a tank inlet and a tank outlet;
- a cooling coil disposed within the coolant tank and over the coolant;
- a refrigerant circulating in the cooling coil;
- a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank;
- a device package disposed in the coolant tank and comprising:
- a package substrate,
- an interposer over the package substrate, and
- a plurality of integrated circuit dies over the interposer;
- a molding layer covering a top surface and sidewalls of the device package;
- and
- a heat sink covering a top surface and sidewalls of the molding layer,
- wherein the reservoir is external to the coolant tank,
- wherein the heat sink comprises a plurality of conformal channels and a plurality of straight channels,
- wherein the plurality of conformal channels track a profile of the molding layer.
12 more elements
A system, comprising:
- a coolant tank containing a coolant;
- a cooling coil disposed within the coolant tank;
- a refrigerant circulating in the cooling coil;
- a temperature sensor disposed within the coolant tank;
- a circulation pump disposed in the coolant tank;
- a management module electrically coupled to the temperature sensor and the circulation pump;
- a device package disposed within the coolant tank and comprising:
- a package substrate,
- a silicon interposer over the package substrate,
- a plurality of integrated circuit (IC) chips over the silicon interposer, and
- an encapsulant disposed among the plurality of IC chips;
- an external shield covering the plurality of IC chips, the encapsulant, sidewalls of the package substrate, and sidewalls of the silicon interposer;
- and
- a heat sink covering a top surface and sidewalls of the external shield,
- wherein the heat sink comprises a plurality of conformal channels that track a profile of the external shield.
12 more elements
A system, comprising:
- a coolant tank containing a coolant;
- a reservoir external to the coolant tank;
- a cooling coil disposed within the coolant tank and over the coolant;
- a refrigerant circulating in the cooling coil;
- a coolant resistance sensor disposed within the coolant tank;
- a circulation pump disposed in the coolant tank;
- a management module coupled to the coolant resistance sensor and the circulation pump;
- a device package immersed in the coolant and comprising:
- a package substrate,
- an interposer bonded to the package substrate by way of bumps, and
- a plurality of integrated circuit (IC) chips over the interposer;
- an external shield covering the plurality of IC chips, sidewalls of the package substrate, and sidewalls of the interposer;
- and
- a heat sink covering a top surface and sidewalls of the external shield,
- wherein the reservoir is in fluid communication with the coolant tank by way of an inlet and an outlet such that the coolant in the coolant tank is drainable to the reservoir,
- wherein the heat sink comprises a plurality of conformal channels that track a profile of the external shield,
- wherein the heat sink comprises copper, aluminum, aluminum nitride, or silicon carbide.
14 more elements
Dependencies are inferred from the claim text.