Systems and methods for liquid cooling of a heat-generating semiconductor device
OwnerYu-Hsun Liinventor
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Abstract
Packages are formed from a heat-generating device and a plurality of MEMS cooling devices attached thereto. Such packages can be cooled using dielectric liquids. Each MEMS cooling device includes an actuator bonded to a carrier wafer. The carrier wafer includes a plurality of holes extending through a substrate. The actuators vibrate and increases the rate of liquid flow past the heat-generating device, improving the cooling effect. Some cooling devices vibrate in one direction, and some cooling devices vibrate in the opposite direction, to further enhance liquid flow.
Claims20
A method for cooling a heat-generating device, comprising:
- placing a package in a cooling fluid;
- wherein the package comprises a plurality of cooling devices attached to a surface of the heat-generating device;
- wherein each cooling device comprises an actuator attached to a carrier wafer;
- wherein the carrier wafer comprises one or more holes that extend through a substrate from a first side to a second side of the substrate;
- and
- wherein the second side of the carrier wafer is bonded to the surface of the heat-generating device to form the package;
- and
- wherein the cooling fluid can flow between the second side of the carrier wafer substrate and the surface of the heat-generating device.
A semiconductor package, comprising:
- a heat-generating semiconductor device;
- and
- a plurality of cooling devices attached to a surface of the heat-generating device;
- wherein each cooling device comprises an actuator bonded to a carrier wafer, wherein the carrier wafer comprises;
- a substrate having an intermediate region between a perimeter region and a central region of the substrate, wherein the intermediate region has a thickness which is less than a thickness of the perimeter region;
- at least one cavity in the intermediate region in a first side of the substrate;
- and
- one or more holes in the at least one cavity that extend from the first side of the substrate to a second side of the substrate.
A method for making a semiconductor package, comprising:
- adhering a plurality of cooling devices to a surface of a heat-generating device;
- wherein each cooling device comprises an actuator and a carrier wafer;
- wherein the carrier wafer comprises one or more holes that extend through a substrate from a first side to a second side of the substrate;
- wherein the first side of the carrier wafer is bonded to the actuator;
- and
- wherein the second side of the carrier wafer is bonded to the surface of the heat-generating device by an adhesive layer.
Dependencies are inferred from the claim text.