H10W 70/00
Package substrates
Official title: Package substrates; Interposers; Redistribution layers [RDL]
H10W70/00 (Package substrates) appears on 64,920 US grants and 72,563 published applications in this corpus.
Search patents in H10W- Granted patents
- 64,920
- Published applications
- 72,563
- Assignees
- 5,775
- Inventors
- 64,389
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 66 | 0 |
| 1977 | 68 | 0 |
| 1978 | 59 | 0 |
| 1979 | 45 | 0 |
| 1980 | 66 | 0 |
| 1981 | 66 | 0 |
| 1982 | 75 | 0 |
| 1983 | 82 | 0 |
| 1984 | 90 | 0 |
| 1985 | 127 | 0 |
| 1986 | 131 | 0 |
| 1987 | 199 | 0 |
| 1988 | 214 | 0 |
| 1989 | 252 | 0 |
| 1990 | 298 | 0 |
| 1991 | 406 | 0 |
| 1992 | 438 | 0 |
| 1993 | 436 | 0 |
| 1994 | 556 | 0 |
| 1995 | 526 | 0 |
| 1996 | 560 | 0 |
| 1997 | 606 | 0 |
| 1998 | 870 | 0 |
| 1999 | 947 | 0 |
| 2000 | 1015 | 0 |
| 2001 | 1241 | 636 |
| 2002 | 1361 | 1610 |
| 2003 | 1404 | 1577 |
| 2004 | 1420 | 1839 |
| 2005 | 1281 | 2059 |
| 2006 | 1413 | 1993 |
| 2007 | 1355 | 2207 |
| 2008 | 1217 | 2309 |
| 2009 | 1291 | 2299 |
| 2010 | 1795 | 2150 |
| 2011 | 1885 | 2124 |
| 2012 | 1988 | 2274 |
| 2013 | 2064 | 2441 |
| 2014 | 2361 | 2867 |
| 2015 | 2626 | 3037 |
| 2016 | 2861 | 2954 |
| 2017 | 3022 | 3090 |
| 2018 | 2795 | 3097 |
| 2019 | 3062 | 3587 |
| 2020 | 3129 | 4039 |
| 2021 | 2988 | 3871 |
| 2022 | 3024 | 4079 |
| 2023 | 3040 | 4115 |
| 2024 | 2988 | 4647 |
| 2025 | 2980 | 4516 |
| 2026 | 2131 | 3146 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 70/60Insulating or insulated package substrates49,288
- H10W 70/01Manufacture or treatment20,716
- H10W 70/40Leadframes14,230
- H10W 70/099Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers10,280
- H10W 70/20Conductive package substrates serving as an interconnection1,032
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Integrated circuit package and method of manufacturing the same6 Oct 2026US 12,754,862 B2SK hynix Inc.
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Display device and method for manufacturing the same6 Oct 2026US 12,757,532 B2LG Display Co., Ltd.
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Manufacturing method of redistribution layer8 Oct 2026US 2026/0310094 A1Shanghai AVIC Optoelectronics Co., Ltd.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Multicolor organic light emitting devices2,173US 5,707,745 AThe Trustees of Princeton University · 1998
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016