Back to results
US 2026/0309912 A1Published application
Wiring substrate
AssigneeIbiden Co., Ltd.
InventorMasatoshi KUNIEDA
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part formed on a surface of the electrical wiring part and including a support plate and an optical waveguide formed on the support plate. The optical wiring part is formed such that the optical waveguide includes at least one core part that transmits light and a cladding part surrounding the at least one core part and that the support plate has a thermal expansion coefficient that is lower than a thermal expansion coefficient of the optical waveguide.
Claims20
A wiring substrate, comprising:
- an electrical wiring part comprising a plurality of insulating layers and a plurality of conductor layers;
- and
- an optical wiring part formed on a surface of the electrical wiring part and comprising an optical waveguide including at least one core part configured to transmit light and a cladding part surrounding the at least one core part,
- wherein the electrical wiring part has a component mounting region configured to be covered by a component configured optically couple with light transmitted through the optical waveguide, and the optical wiring part is formed such that the at least one core part has a first end part that overlaps with or is adjacent to the component mounting region, and a second end part on an opposite side with respect to the first end part, and is extending from the component mounting region toward an outer edge of the electrical wiring part.
1 more element
Dependencies are inferred from the claim text.