H10W 70/20
Conductive package substrates serving as an interconnection
Official title: Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
H10W70/20 (Conductive package substrates serving as an interconnection) appears on 1,032 US grants and 1,065 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,032
- Published applications
- 1,065
- Assignees
- 368
- Inventors
- 1,940
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 5 | 0 |
| 1980 | 9 | 0 |
| 1981 | 8 | 0 |
| 1982 | 8 | 0 |
| 1983 | 5 | 0 |
| 1984 | 10 | 0 |
| 1985 | 8 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 3 |
| 2002 | 3 | 7 |
| 2003 | 4 | 14 |
| 2004 | 13 | 30 |
| 2005 | 19 | 34 |
| 2006 | 24 | 24 |
| 2007 | 21 | 37 |
| 2008 | 13 | 18 |
| 2009 | 25 | 21 |
| 2010 | 18 | 26 |
| 2011 | 22 | 20 |
| 2012 | 20 | 27 |
| 2013 | 26 | 45 |
| 2014 | 40 | 56 |
| 2015 | 57 | 76 |
| 2016 | 75 | 84 |
| 2017 | 65 | 67 |
| 2018 | 59 | 67 |
| 2019 | 63 | 64 |
| 2020 | 66 | 74 |
| 2021 | 60 | 70 |
| 2022 | 56 | 47 |
| 2023 | 38 | 50 |
| 2024 | 37 | 51 |
| 2025 | 29 | 25 |
| 2026 | 30 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device and electronic system including the same6 Oct 2026US 12,757,720 B2Samsung Electronics Co., Ltd.
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Bus bar and power electronic device with current shaping terminal connector and method of making a terminal connector22 Sep 2026US 12,744,355 B2Transportation IP Holdings, LLC
- Semiconductor device25 Aug 2026US 12,721,188 B2Fuji Electric Co., Ltd.
- Resin-sealed semiconductor device18 Aug 2026US 12,713,916 B2Mitsubishi Electric Corporation
- Semiconductor device and method of manufacturing the same1 Oct 2026US 2026/0305376 A1Renesas Electronics Corporation
- Chip package and circuit device for virtual currency computation24 Sep 2026US 2026/0293701 A1Bitdeer Semiconductor Technology PTE. LTD.
- Semiconductor element mounting substrate17 Sep 2026US 2026/0282922 A1Niterra Co., Ltd.
- Semiconductor element mounting substrate17 Sep 2026US 2026/0282944 A1Niterra Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices17 Sep 2026US 2026/0283000 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- High performance flip chip package189US 6,133,634 AFairchild Semiconductor Corporation · 2000
- Integrated circuit package for flexible computer system alternative architectures149US 5,376,825 ASeiko Epson Corporation · 1994
- Ball grid array package with patterned stiffener layer115US 6,906,414 B2Broadcom Corporation · 2005
- High performance multi-chip flip chip package109US 6,489,678 B1Fairchild Semiconductor Corporation · 2002