H10W 70/24
Characterised by materials
Official title: {characterised by materials}
H10W70/24 (Characterised by materials) appears on 220 US grants and 196 published applications in this corpus.
Search patents in H10W- Granted patents
- 220
- Published applications
- 196
- Assignees
- 135
- Inventors
- 520
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 6 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 4 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 1 | 4 |
| 2007 | 3 | 7 |
| 2008 | 2 | 5 |
| 2009 | 3 | 1 |
| 2010 | 3 | 5 |
| 2011 | 4 | 4 |
| 2012 | 3 | 2 |
| 2013 | 4 | 9 |
| 2014 | 1 | 7 |
| 2015 | 6 | 12 |
| 2016 | 12 | 21 |
| 2017 | 17 | 11 |
| 2018 | 12 | 12 |
| 2019 | 9 | 11 |
| 2020 | 9 | 12 |
| 2021 | 10 | 14 |
| 2022 | 7 | 6 |
| 2023 | 8 | 17 |
| 2024 | 12 | 15 |
| 2025 | 9 | 6 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer26 May 2026US 12,642,122 B2Amkor Technology Singapore Holding Pte.Ltd.
- Tip connection portion of terminal member and associated semiconductor device9 Dec 2025US 12,494,415 B2Shindengen Electric Manufacturing Co., Ltd.
- Busbar with dielectric coating25 Nov 2025US 12,482,726 B2Microchip Technology Caldicot Limited
- Semiconductor device and method of manufacturing the same1 Oct 2026US 2026/0305376 A1Renesas Electronics Corporation
- Chip package and circuit device for virtual currency computation24 Sep 2026US 2026/0293701 A1Bitdeer Semiconductor Technology PTE. LTD.
- Electronic devices and methods of manufacturing electronic devices17 Sep 2026US 2026/0283000 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device and vehicle3 Sep 2026US 2026/0262497 A1Rohm Co., Ltd.
- Multistage sealed power-electronic module23 Jul 2026US 2026/0215334 A1
Most cited
By later US patents
- Integrated circuit packaging systems with double surface heat dissipation65US 4,620,215 AAmdahl Corporation · 1986
- Semiconductor device including plateless package fabrication method42US 4,631,805 AMotorola, Inc. · 1986
- High temperature, stable SiC device interconnects and packages having low thermal resistance42US 7,390,735 B2Teledyne Licensing, LLC · 2008
- Semiconductor device including plateless package40US 4,546,374 AMotorola, Inc. · 1985
- Method of making electronic chip with metalized back including a surface stratum of solder38US 4,451,972 ANational Semiconductor Corporation · 1984