Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer

A method to manufacture an electronic device, comprising:

• providing a first substrate comprising a first dielectric structure and a first conductive structure;
• providing a first electronic component over the first substrate and coupled to the first conductive structure, wherein the first electronic component comprises a first side oriented toward the first substrate and a second side oriented away from the first substrate;
• providing a second electronic component coupled to the first conductive structure;
• providing an interconnect coupled to the first conductive structure;
• providing an encapsulant over the first substrate and covering a lateral side of the first electronic component, wherein the lateral side of the first electronic component is between the first side of the first electronic component and the second side of the first electronic component, and wherein the encapsulant is between the interconnect and the lateral side of the first electronic component;
• and
• providing a second substrate over the first electronic component and comprising a second dielectric structure and a second conductive structure, wherein the interconnect is coupled to the second conductive structure;
• wherein:
• a first one of the first substrate or the second substrate comprises a redistribution layer (RDL) substrate;
• a second one of the first substrate or the second substrate comprises a laminate substrate;
• the laminate substrate comprises a first side facing toward the first electronic component, a second side facing away from the first electronic component, and a lateral side between the first side of the laminate substrate and the second side of the laminate substrate;
• the encapsulant covers the lateral side of the laminate substrate;
• and
• the first electronic component is between the first substrate and the second substrate;
• the first electronic component is coupled to a first side of the first substrate;
• the second electronic component is coupled to a second side of the first substrate opposite to the first side;
• and
• the first electronic component is in the encapsulant, and the second electronic component is external to the encapsulant.

An electronic device, comprising:

• a first substrate comprising a first dielectric structure and a first conductive structure;
• a first electronic component over the first substrate and coupled to the first conductive structure;
• a second electronic component coupled to the first conductive structure;
• a second substrate over the first electronic component and comprising a second dielectric structure and a second conductive structure;
• an encapsulant between the first substrate and the second substrate;
• and
• an interconnect in the encapsulant and coupled to the first conductive structure and the second conductive structure;
• wherein:
• the first substrate comprises a redistribution layer (RDL) substrate;
• the second substrate comprises a laminate substrate comprising a core structure;
• the first electronic component is between the first substrate and the second substrate;
• the first electronic component is coupled to a first side of the first substrate;
• the second electronic component is coupled to a second side of the first substrate opposite to the first side;
• and
• the first electronic component is in the encapsulant, and the second electronic component is external to the encapsulant.