H10W 70/26
Semiconductor materials
Official title: {Semiconductor materials}
H10W70/26 (Semiconductor materials) appears on 18 US grants and 24 published applications in this corpus.
Search patents in H10W- Granted patents
- 18
- Published applications
- 24
- Assignees
- 23
- Inventors
- 78
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 1 | 3 |
| 2014 | 0 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 3 |
| 2020 | 2 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 1 | 3 |
| 2024 | 1 | 4 |
| 2025 | 0 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer26 May 2026US 12,642,122 B2Amkor Technology Singapore Holding Pte.Ltd.
- Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer20 Feb 2024US 11,908,761 B2Amkor Technology Singapore Holding Pte.Ltd.
- Electrionic devices with interposer and redistribution layer24 Jan 2023US 11,562,936 B2Amkor Technology Singapore Holding Pte.Ltd.
- Silicon wafer manufacturing method2 Feb 2021US 10,910,328 B2Sumco Corporation
- Semiconductor device5 May 2020US 10,643,922 B2Mitsubishi Electric Corporation
- Electronic devices and methods of manufacturing electronic devices17 Sep 2026US 2026/0283000 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package and manufacturing method thereof30 Apr 2026US 2026/0123556 A1Samsung Electronics Co., Ltd.
- Heavily doped semiconductor devices for power distribution13 Feb 2025US 2025/0054854 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor device, method of manufacturing semiconductor device, and semiconductor package including semiconductor device26 Sep 2024US 2024/0321774 A1Samsung Electronics Co., Ltd.
- Substrate support22 Aug 2024US 2024/0282649 A1Tokyo Ohka Kogyo.Co., Ltd.
Most cited
By later US patents
- Semiconductor device using SiC as supporter of a semiconductor element33US 4,352,120 AHitachi, Ltd. · 1982
- Process for forming compound semiconductor bodies21US 4,261,781 AInternational Business Machines Corporation · 1981
- Methods of fabricating fan-out wafer level packages and packages formed by the methods14US 9,202,716 B2Samsung Electronics Co., Ltd. · 2015
- Semiconductor device13US 4,646,126 AKabushiki Kaisha Toshiba · 1987
- Multi-chip module10US 5,365,405 ASiemens Aktiengesellschaft · 1994