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US 2024/0282649 A1Published application
Substrate support
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsYubun Kikuchi, Yoshihiro Yamada, Ryuma Mizusawa
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Abstract
A substrate support that allows for effortless debonding of a circuit pattern, the substrate support including a base material having a bonding surface to which a semiconductor substrate (circuit pattern) is bonded; and an adhesive layer having a pattern of dots formed in at least a portion of the bonding surface.
Claims19
A substrate support comprising:
- a base material having a bonding surface to which a semiconductor substrate is bonded;
- and
- an adhesive layer having a pattern of dots formed in at least a portion of the bonding surface.
Dependencies are inferred from the claim text.