Electrionic devices with interposer and redistribution layer

A method to manufacture an electronic device, comprising:

• providing a base substrate comprising a base substrate conductive structure;
• providing a first electronic component over a first side of the base substrate;
• providing a vertical interconnect over the first side of the base substrate and coupled with the base substrate conductive structure;
• providing an encapsulant over the first side of the base substrate, wherein the encapsulant contacts a lateral side of the first electronic component and the vertical interconnect;
• and
• providing an interposer substrate over a first side of the encapsulant and comprising an interposer substrate conductive structure, wherein the interposer substrate conductive structure is coupled with the vertical interconnect;
• wherein:
• a first one of the base substrate or the interposer substrate comprises a redistribution layer (RDL) substrate comprising a coreless substrate;
• and
• a second one of the base substate or the interposer substrate comprises a laminate substrate comprising a printed circuit board.

A method to manufacture an electronic device, comprising:

• providing a first substrate comprising a first substrate conductive structure, wherein the first substrate comprises a redistribution layer (RDL) substrate;
• providing a vertical interconnect over a first side of the first substrate and coupled with the first substrate conductive structure;
• providing an electronic component over the first substrate and coupled with the first substrate;
• providing an encapsulant over the first side of the first substrate and contacting a lateral side of the electronic component and the vertical interconnect;
• coupling the vertical interconnect with a second conductive structure of a second substrate;
• and
• providing an underfill between the electronic component and the second substrate;
• wherein:
• a first one of the first substrate or the second substrate comprises a redistribution layer (RDL) substrate comprising a coreless substrate;
• and
• a second one of the first substrate or the second substrate comprises a laminate substrate comprising a printed circuit board.