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US 10,643,922 B2Granted
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsYoshitaka Otsubo, Yoshitaka Kimura
Life of this patent
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Abstract
A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.
Claims10
A semiconductor device comprising:
- a base plate bonded to a case by means of a bonding agent, wherein
- the base plate includes a heat dissipation metal plate having a heat dissipation property, and a resin insulating layer structured by resin,
- the resin insulating layer is formed on the heat dissipation metal plate,
- the resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed,
- the case is bonded, by means of the bonding agent, to an exposure part being a groove existing in the heat dissipation metal plate and exposed by the notch, and
- the bonding agent directly contacts with the case and an inner surface of the groove existing in the heat dissipation metal plate.
3 more elements
Dependencies are inferred from the claim text.