US 4,546,374 A · Semiconductor device including plateless package

Abstract

A semiconductor device including a metallurgically compatible unplated package is provided. The package includes a plateless copper alloy die mount area to which a semiconductor die is attached. The semiconductor die is metallized on its mounting surface to provide electrical contact. A metallic solder which is compatible with both the copper alloy and the die metallization joins the die to the die mount area. The package further includes a plateless copper alloy lead portion which is physically joined to the die mount area. The top surface of the semiconductor die is provided with a patterned metallization making electrical contact to selected portions of the die. Electrical contact is made between the top surface die metallization and the lead portion of the package by ultrasonically bonded copper ribbon. The die and interconnecting ribbon is then enclosed by an epoxy encapsulant or by a welded metal cover.

Claims11

Dependent claims

A semiconductor device comprising in combination:

an unplated copper alloy die mount package portion;
a semiconductor die having first and second surfaces;
a first metallization on said first surface and making electrical contact thereto;
a non lead-based, non gold-based metallic solder metallurgically compatible with said first metallization and with said copper alloy die mount package portion, said solder joining said die to said die mount package portion;
a second metallization patterned on said second surface and making electrical contact to selected portions thereof;
a copper alloy lead connector package portion mechanically fixed with respect to said die mount package portion;
copper connecting means ultrasonically bonded between and electrically interconnecting said second patterned metallization and said lead connector package portion;
and means for enclosing said semiconductor die, said copper connecting means, and a portion of each of said die mount and lead connector package portions.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor device including plateless package

Life of this patent

Semiconductor device including plateless package

Life of this patent

Abstract

Claims11