Back to results
US 12,494,415 B2Granted
Tip connection portion of terminal member and associated semiconductor device
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsSoichiro Umeda, Atsushi Kyutoku
Life of this patent
Estimating the term…
Abstract
A terminal member connected to a connection target portion includes: a bent portion bent toward the connection target portion; and a tip connection portion provided at a tip part of the bent portion, in which the tip connection portion is connected to the connection target portion via a conductive bonding material.
Claims4
A terminal member connected to a connection target portion, the terminal member and formed of plate material, comprising:
- a bent portion bent toward the connection target portion;
- and
- a tip connection portion provided at a tip part of the bent portion and being a cross section formed by being punched out in a press processing in a direction of a plate thickness,
- wherein the tip connection portion is connected to the connection target portion via a conductive bonding material;
- wherein the tip connection portion is formed in a curved surface shape and is in linear contact with the connection target portion, and
- wherein the bent portion is bent with a curvature center line as a bending center, and a location that is in linear contact with a conductor portion on the tip connection portion extends in a direction orthogonal to the curvature center line.
3 more elements
Dependencies are inferred from the claim text.