H10W 70/28
Carbon-containing materials
Official title: {Carbon-containing materials}
H10W70/28 (Carbon-containing materials) appears on 23 US grants and 14 published applications in this corpus.
Search patents in H10W- Granted patents
- 23
- Published applications
- 14
- Assignees
- 15
- Inventors
- 47
- Latest grant
- 7 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 2 | 2 |
| 2017 | 0 | 1 |
| 2018 | 4 | 3 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Semiconductor device with a supporting member and bonded metal layers7 Jan 2025US 12,191,223 B2Rohm Co., Ltd.
- Semiconductor device with a supporting member and bonded metal layers15 Aug 2023US 11,728,237 B2Rohm Co., Ltd.
- Interconnect structure having a graphene layer21 Dec 2021US 11,205,617 B2Semiconductor Manufacturing International (Beijing) Corporation
- Semiconductor device and method of manufacturing semiconductor device16 Apr 2019US 10,262,925 B2Fuji Electric Co., Ltd.
- Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement30 Oct 2018US 10,115,646 B2Infineon Technologies AG
- Semiconductor device10 Aug 2023US 2023/0253283 A1Rohm Co., Ltd.
- Semiconductor device9 Dec 2021US 2021/0384097 A1Rohm Co., Ltd.
- Semiconductor device and method of manufacturing semiconductor device4 Oct 2018US 2018/0286788 A1Fuji Electric Co., Ltd.
- Interconnect structure having a graphene layer14 Jun 2018US 2018/0166391 A1Semiconductor Manufacturing International (Beijing) Corporation
- Method for capping cu layer using graphene in semiconductor4 Jan 2018US 2018/0005952 A1Semiconductor Manufacturing International (Beijing) Corporation
Most cited
By later US patents
- Copper matrix electrode having carbon fibers therein25US 4,470,063 AHitachi, Ltd. · 1984
- Semiconductor device19US 4,196,442 AHitachi, Ltd. · 1980
- Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers17US 4,213,801 ABell Telephone Laboratories, Incorporated · 1980
- Sealable electronics packages16US 5,675,122 APacific Coast Technologies, Inc. · 1997
- Sealable electronics packages and methods of producing and sealing such packages13US 5,433,260 APacific Coast Technologies, Inc. · 1995