Semiconductor device and method of manufacturing semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorAkira Iso
Life of this patent
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Abstract
A semiconductor device includes a base plate to which a stacked substrate is bonded, the stacked substrate being mounted on a semiconductor chip. The semiconductor device further includes a heat sink mounted to the base plate, via thermal paste and a metal ring. A center hole of the metal ring is provided to face the semiconductor chip and the thermal paste fills the center hole. Further, the metal ring is formed using a material having about a same hardness as the heat sink, or a material having a lower hardness than the hardness of the heat sink.
Claims11
A semiconductor device, comprising:
- a stacked substrate having opposing first and second sides;
- a semiconductor chip mounted on the first side of the stacked substrate;
- a base plate having opposing first and second sides and being mounted on the second side of the stacked substrate;
- a metal ring having a through opening, and having opposing first and second sides, the first side of the metal ring being mounted on the second side of the base plate;
- and
- a heat sink mounted to the second side of the base plate, via a thermal paste, with the metal ring therebetween.
A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor chip, a stacked substrate having opposing first and second sides, a base plate having opposing first and second sides, a heat sink and a metal ring having a through opening;
- mounting the semiconductor chip to the first side of the stacked substrate, and mounting the stacked substrate to the first side of the base plate;
- applying a thermal paste to one of the heat sink and the second side of the base plate;
- mounting the heat sink to the second side of the base plate using the thermal paste, with the metal ring therebetween, the thermal paste being disposed within an area inside of the through opening of the metal ring, a thickness of the metal ring being at most a thickness of the thermal paste.
Dependencies are inferred from the claim text.