Semiconductor device
AssigneeHitachi, Ltd.
InventorsKeiichi Kuniya, Hideo Arakawa, Kunihiro Maeda, Keiichi Morita
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Abstract
A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an electrically conductive metal. The coefficient of the thermal expansion of the fibers is substantially equal to or smaller than that of the semiconductor substrate. The fiber is arrayed in an annular, circular, spiral or the like pattern at least in the surface portion of the composite body on which the composite body is bonded to the substrate.
Claims6
A semiconductor device including a semiconductor substrate and a supporting electrode bonded to at least one surface of said semiconductor substrate, wherein said supporting electrode comprises a composite body having fibers embedded in substantially uniform distribution in a matrix of an electrically conductive metal, the coefficient of thermal expansion of said fibers being substantially equal to or smaller than that of said substrate, with said fibers being arrayed in an annular configuration having a plurality of annuluses, in at least a surface portion of said composite body at which said composite body is bonded to said semiconductor substrate, said annuluses being arranged substantially in parallel with said surface portion and concentrically around a center of said surface portion.
Dependencies are inferred from the claim text.