Sealable electronics packages
AssigneePacific Coast Technologies, Inc.
InventorEdward A. Taylor
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Abstract
Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The apparatus of the present invention are especially suitable for hermetically sealing metal matrix composite electronics packages.
Claims22
A sealable electronics package characterized by desirable weight, thermal expansion and thermal conduction properties, comprising:
- a base;
- at least one sidewall extending from the base;
- an aperture in the sidewall bordered by a first sealing means, the first sealing means consisting of a laminate of two dissimilar metallic materials, said dissimilar metallic materials being bonded together at an interface therebetween, wherein one of said laminate materials is hermetically bonded to the sidewall and the other is hermetically bondable to a first component placed within the aperture.
A sealable electronics package characterized by desirable weight, thermal expansion and thermal conduction properties, comprising:
- at least one surface member having an aperture therein;
- a component to be sealably mounted in said aperture;
- and
- a seal facilitating means including a laminate of two dissimilar metallic materials located within said aperture, said dissimilar metallic materials being bonded together at an interface therebetween the seal facilitating means being hermetically bonded to the surface member and hermetically bondable to the component by conventional processing.
Dependencies are inferred from the claim text.