Sealable electronics packages and methods of producing and sealing such packages
AssigneePacific Coast Technologies, Inc.
InventorEdward A. Taylor
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Abstract
Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The methods and apparatus of the present inventions are especially suitable for hermetically sealing metal matrix composite electronics packages.
Claims22
A method of producing a sealable electronics package, comprising:
- preforming at least one seal facilitating means including a laminate of two dissimilar materials;
- and
- bonding said seal facilitating means to an electronics package base during a casting operation thereby providing a sealing surface at which a hermetic seal to a component to be sealed is formable.
A method of producing a sealable electronics package, comprising:
- providing a seal facilitating means that includes a bonded laminate having a first surface that is bondable to a first component and a second surface that is bondable to a second component;
- constructing a mold to form said first component by a casting operation, said mold including said seal facilitating means as a preform;
- filling said mold with a molten material that forms said first component;
- and
- causing a metallurgical bond between said first surface of said laminate and said first component so as to present said second surface of said laminate for bonding to said second component.
Dependencies are inferred from the claim text.