US 4,470,063 A · Copper matrix electrode having carbon fibers therein

Abstract

A semiconductor device includes a semiconductor substrate having electrodes brazed thereto. The electrode is made of a Cu-C composite material in which carbon fibers are embedded in copper matrix. The carbon fibers are so disposed as to be in a ring-like shape or a loop shape substantially in parallel with a surface of the semiconductor substrate onto which the electrode is brazed. The carbon fibers disposed in an outer peripheral portion have a higher longitudinal elastic modulus than that of the carbon fibers positioned at a central portion of the electrode. The electrode thus has a thermal expansion coefficient approximating to that of the semiconductor substrate. Content of copper can be increased at the central portion of the electrode for attaining a high thermal conductivity.

Claims16

Dependent claims

A semiconductor device comprising:

(a) a semiconductor substrate having at least one pn-junction;
(b) at least one electrode for supporting said semiconductor substrate, said electrode being made of a composite material in which carbon fibers are embedded in a ring-like shape in a copper matrix, the plane of the ring-like shape being substantially parallel with the surface of said electrode for supporting said semiconductor substrate;
wherein at least the carbon fibers embedded in an outer peripheral portion of said electrode having a greater longitudinal elastic modulus than that of the carbon fibers embedded in a central portion of said electrode;
and
(c) brazing material for attaching said electrodes to said semiconductor substrate.

2 more elements

Dependencies are inferred from the claim text.

Copper matrix electrode having carbon fibers therein

Life of this patent

Copper matrix electrode having carbon fibers therein

Life of this patent

Abstract

Claims16