Ball grid array package with patterned stiffener layer

A ball grid array (BGA) package, comprising:

• a stiffener that has
• a substantially planar first surface having a centrally located cavity,
• a substantially planar second surface opposed to said first surface of said stiffener, wherein said second surface of said stiffener has a centrally located protruding portion that opposes said centrally located cavity, and
• at least one recessed portion in an edge of said first and said second surfaces of said stiffener, wherein said at least one edge has a first corner at a first end and a second corner at a second end, wherein said at least one recessed portion is located between said first and second corners of said at least one edge;
• a substantially planar substrate that has
• a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, and
• a centrally located window opening that is open at said first and second surfaces of said substrate, wherein said substrate is attached to said second surface of said stiffener such that said protruding portion extends through said window opening;
• and
• an IC die mounted to said first surface of said stiffener in said cavity.

A stiffener for stiffening a substrate in a ball grid array (BGA) package, comprising:

• a substantially planar first surface having a centrally located cavity;
• a substantially planar second surface opposed to said first surface, wherein said second surface has a centrally located protruding portion that opposes said centrally located cavity;
• and
• at least one recessed portion in at least one edge of said first and said second surfaces, wherein said at least one recessed portion includes a first recessed portion that has at least one notch formed in at least one edge of said first recessed portion wherein the second surface is capable of attachment to the substrate such that said protruding portion extends through a centrally located window opening that is open at first and second surfaces of the substrate, and
• wherein said first surface of said stiffener in said cavity is capable of mounting an integrated circuit die.

A stiffener for stiffening a substrate in a ball grid array (BGA) package, comprising:

• a substantially planar first surface having a centrally located cavity;
• a substantially planar second surface opposed to said first surface, wherein said second surface has a centrally located protruding portion that opposes said centrally located cavity;
• and
• at least one recessed portion in at least one edge of said first and said second surfaces, wherein said at least one recessed portion is configured for at least one wire bond to extend therethrough wherein the second surface is capable of attachment to the substrate such that said protruding portion extends through a centrally located window opening that is open at first and second surfaces of the substrate, and
• wherein said first surface of said stiffener in said cavity is capable of mounting an integrated circuit die.

A ball grid array (BGA) package, comprising:

• a stiffener that has
• a substantially planar first surface having a centrally located cavity,
• a substantially planar second surface opposed to said first surface of said stiffener, wherein said second surface of said stiffener has a centrally located protruding portion that opposes said centrally located cavity, and
• at least one recessed portion in an edge of said first and said second surfaces of said stiffener, wherein said at least one recessed portion includes a first recessed portion that has at least one notch formed in at least one edge of said first recessed portion;
• a substantially planar substrate that has
• a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, and
• a centrally located window opening that is open at said first and second surfaces of said substrate, wherein said substrate is attached to said second surface of said stiffener such that said protruding portion extends through said window opening;
• and
• an IC die mounted to said first surface of said stiffener in said cavity.

A ball grid array (BGA) package, comprising:

• a stiffener that has
• a substantially planar first surface having a centrally located cavity,
• a substantially planar second surface opposed to said first surface of said stiffener, wherein said second surface of said stiffener has a centrally located protruding portion that opposes said centrally located cavity, and
• at least one recessed portion in an edge of said first and said second surfaces of said stiffener;
• a substantially planar substrate that has
• a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, and
• a centrally located window opening that is open at said first and second surfaces of said substrate, wherein said substrate is attached to said second surface of said stiffener such that said protruding portion extends through said window opening;
• an IC die mounted to said first surface of said stiffener in said cavity;
• and
• a wire bond that extends through a first recessed portion of said at least one recessed portion, wherein said wire bond couples a bond pad of said IC die to a first contact pad on said first surface of said substrate.