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US 2026/0282944 A1Published application
Semiconductor element mounting substrate
AssigneeNiterra Co., Ltd.
InventorsYosuke KONDO, Tatsunori MURASE, Kenzo USAMI, Mitsuru NISHIMURA, Yukihiro WATANABE, Isuzu SANO
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Abstract
A semiconductor element mounting substrate includes a base composed of a metal, an electrode to be connected to a semiconductor element, and an insulating layer disposed between the base and the electrode, in which a maximum height Sz (micrometers) of a base-side surface of the insulating layer specified by ISO 25178 is equal to or less than the thickness of the layer itself.
Claims14
A semiconductor element mounting substrate comprising:
- a base composed of a metal;
- an electrode to be connected to a semiconductor element;
- and
- an insulating layer that is disposed between the base and the electrode, wherein a maximum height Sz (micrometers) of a base-side surface specified by ISO 25178 is equal to or less than the thickness of the layer itself.
1 more element
Dependencies are inferred from the claim text.