H10W 70/22
Having an heterogeneous or anisotropic structure
Official title: {having an heterogeneous or anisotropic structure}
H10W70/22 (Having an heterogeneous or anisotropic structure) appears on 82 US grants and 68 published applications in this corpus.
Search patents in H10W- Granted patents
- 82
- Published applications
- 68
- Assignees
- 61
- Inventors
- 175
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 0 |
| 2005 | 0 | 5 |
| 2006 | 2 | 4 |
| 2007 | 1 | 3 |
| 2008 | 4 | 2 |
| 2009 | 1 | 3 |
| 2010 | 2 | 0 |
| 2011 | 1 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 2 | 3 |
| 2017 | 2 | 3 |
| 2018 | 4 | 8 |
| 2019 | 3 | 1 |
| 2020 | 5 | 9 |
| 2021 | 5 | 6 |
| 2022 | 4 | 4 |
| 2023 | 6 | 6 |
| 2024 | 4 | 1 |
| 2025 | 3 | 3 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- High thermal dissipation, packaged electronic device and manufacturing process thereof22 Jul 2025US 12,368,126 B2STMicroelectronics S,r.l.
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- Semiconductor device8 Jan 2026US 2026/0011625 A1Fuji Electric Co., Ltd.
- High thermal dissipation, packaged electronic device and manufacturing process thereof9 Oct 2025US 2025/0316633 A1STMicroelectronics S,r.l.
- Power device cell and power electronics assembly including the power device cell13 Mar 2025US 2025/0087561 A1
Most cited
By later US patents
- Integrated circuit package for flexible computer system alternative architectures149US 5,376,825 ASeiko Epson Corporation · 1994
- Fabrication of CPI layers66US 4,820,376 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Information handling system including a circuitized substrate having a dielectric layer without continuous fibers53US 7,508,076 B2Endicott Interconnect Technologies, Inc. · 2009
- Stacked structure having matrix-fibered composite layers and a metal layer42US 4,482,912 AHitachi, Ltd. · 1984
- Semiconductor device having supporting electrode composite structure of metal containing fibers33US 3,969,754 AHitachi, Ltd. · 1976