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US 7,508,076 B2Granted
Information handling system including a circuitized substrate having a dielectric layer without continuous fibers
AssigneeEndicott Interconnect Technologies, Inc.
InventorsRobert Japp, Voya Markovich, Cheryl Palomaki, Kostas Papathomas, David L. Thomas
Life of this patent
Estimating the term…
Abstract
An information handling system which includes as part thereof a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.
Claims18
An information handling system comprising as part thereof:
- a circuitized substrate including a first dielectric layer including an epoxy resin material and a filler comprising particles having a size within the range of from about 200 Angstroms to about 35 microns, said particles comprising from about 10 percent to about 80 percent by volume of said first dielectric layer, said first dielectric layer including reinforcing fibers, said fibers not including continuous or semi-continuous strands as part thereof, said first dielectric layer further including a plurality of conductive thru-holes therein having a pattern density of from about 5,000 to about 10,000 holes per square inch of said first dielectric layer, said first dielectric layer having a dielectric constant within the range of from about 3.5 to about 4.0, and at least one circuitized layer positioned on said first dielectric layer;
- and
- at least one electrical component positioned on and electrically coupled to said circuitized substrate.
Dependencies are inferred from the claim text.