Fabrication of CPI layers
AssigneeAmerican Telephone and Telegraph Company, AT&T Bell Laboratories
InventorsWilliam R. Lambert, Neng-Hsing Lu, Ray D. Rust
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Abstract
Disclosed is a method of fabricating conductive polymer interconnect (CPI) material which employs chains of electrically conductive particles within an elastomeric matrix. Contact resistance is improved by removing a thin layer is elastomeric material which remains after normal processing. The surface layer is removed by plasma etching so that the conductive particles protrude at both surfaces. The protruding particles can be plated to replace any conductive material removed by the etch.
Claims9
A method of fabricating a layer of silicone elastomer material including chains of electrically conducting particles extending essentially perpendicular to the major surfaces of the layer, the method comprising the step of removing a portion of at least one of said major surfaces by plasma etching so that the particles at the ends of said chains protrude through the etched surface.
Dependencies are inferred from the claim text.