H10W 70/01
Manufacture or treatment
H10W70/01 (Manufacture or treatment) appears on 20,716 US grants and 24,703 published applications in this corpus.
Search patents in H10W- Granted patents
- 20,716
- Published applications
- 24,703
- Assignees
- 2,499
- Inventors
- 23,399
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 25 | 0 |
| 1977 | 20 | 0 |
| 1978 | 13 | 0 |
| 1979 | 12 | 0 |
| 1980 | 16 | 0 |
| 1981 | 18 | 0 |
| 1982 | 21 | 0 |
| 1983 | 18 | 0 |
| 1984 | 15 | 0 |
| 1985 | 31 | 0 |
| 1986 | 30 | 0 |
| 1987 | 47 | 0 |
| 1988 | 46 | 0 |
| 1989 | 59 | 0 |
| 1990 | 67 | 0 |
| 1991 | 75 | 0 |
| 1992 | 100 | 0 |
| 1993 | 115 | 0 |
| 1994 | 122 | 0 |
| 1995 | 104 | 0 |
| 1996 | 118 | 0 |
| 1997 | 139 | 0 |
| 1998 | 159 | 0 |
| 1999 | 182 | 0 |
| 2000 | 173 | 0 |
| 2001 | 236 | 109 |
| 2002 | 238 | 305 |
| 2003 | 273 | 297 |
| 2004 | 251 | 417 |
| 2005 | 253 | 438 |
| 2006 | 306 | 469 |
| 2007 | 294 | 478 |
| 2008 | 299 | 552 |
| 2009 | 273 | 516 |
| 2010 | 403 | 557 |
| 2011 | 473 | 606 |
| 2012 | 505 | 676 |
| 2013 | 570 | 682 |
| 2014 | 646 | 842 |
| 2015 | 768 | 1055 |
| 2016 | 1016 | 1211 |
| 2017 | 1237 | 1455 |
| 2018 | 1284 | 1376 |
| 2019 | 1339 | 1585 |
| 2020 | 1390 | 1755 |
| 2021 | 1261 | 1595 |
| 2022 | 1250 | 1698 |
| 2023 | 1277 | 1544 |
| 2024 | 1248 | 1749 |
| 2025 | 1197 | 1658 |
| 2026 | 704 | 1078 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet6 Oct 2026US 12,757,747 B2
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Manufacturing method of redistribution layer8 Oct 2026US 2026/0310094 A1Shanghai AVIC Optoelectronics Co., Ltd.
- Manufacturing method of the semiconductor package8 Oct 2026US 2026/0314301 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Formation of microstamped patterns on surfaces and derivative articles1,049US 5,512,131 APresident and Fellows of Harvard College · 1996
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015