Formation of microstamped patterns on surfaces and derivative articles

A method of etching an electrically conductive material provided on a substrate, comprising the steps of:

• (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern, said indentations contiguous with a stamping surface defining a stamping pattern;
• (b) coating said stamping surface with a molecular species terminating at a first end in a functional group selected to bind to said conductive material;
• (c) contacting first portions of a surface of said conductive material with said stamping surface to hold said molecular species against said conductive material surface portions to allow said functional group to bind thereto;
• (d) removing said stamping surface to provide a self-assembled monolayer of said molecular species on said first conductive material surface portions according to said stamping pattern, second portions of said conductive material surface remaining free of said molecular species according to said indentation pattern;
• (e) contacting said second conductive material surface portions with a reactant selected to react chemically therewith and selected to be chemically inert with respect to said molecular species, such that said second portions of said conductive material are degraded;
• (f) removing said degraded portions of said conductive material;
• and
• (g) removing said molecular species to uncover said first portions of said conductive material formed according to said stamping pattern.

A method of etching an electrically conductive material provided on a substrate, comprising the steps of:

• (a) using a stamp formed from a micromachined mold to transfer a molecular species to an electrically conductive material provided on a substrate, said molecular species forming a self-assembled layer, said self-assembled layer being contiguous with exposed portions of said electrically conductive material;
• (b) contacting said exposed conductive material portions with a reactant selected to react chemically therewith and selected to be chemically inert with respect to said molecular species, such that said exposed portions are degraded;
• (c) removing said degraded portions;
• and
• (d) removing said molecular species.

A method of plating a predetermined pattern of material on a substrate, comprising the steps of:

• (a) using a stamp formed from a micromachined mold to transfer a molecular species to a substrate, said molecular species forming a self-assembled layer, said self-assembled layer being contiguous with exposed portions of said substrate;
• (b) plating said exposed substrate portions with a plating reagent;
• and
• (c) removing said molecular species.

A method of plating a predetermined pattern of material on a substrate, comprising the steps of:

• (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern, said indentations contiguous with a stamping surface defining a stamping pattern;
• (b) coating said stamping surface with a molecular species terminating at a first end in a functional group selected to bind to said substrate;
• (c) contacting first portions of a surface of said substrate with said stamping surface to hold said molecular species against said first substrate surface portions to allow said functional group to bind thereto;
• (d) removing said stamping surface to provide a self-assembled monolayer of said molecular species on said first substrate surface portions according to said stamping pattern, second portions of said substrate surface contiguous with said first portions remaining free of said molecular species according to said indentation pattern;
• (e) plating said second substrate surface portions with a plating reagent;
• and
• (f) removing said molecular species to uncover said first portions of said substrate surface according to said stamping pattern bordered by plated portions of said substrate surface according to said indentation pattern.

A method of patterning a material surface, comprising the steps of:

• (a) providing a stamp having a surface including at least one indentation formed therein, said indentation contiguous with a stamping surface defining a first pattern, said stamping surface having at least one feature having a lateral dimension of less than 100 microns;
• (b) coating said stamping surface with a molecular species selected to bind to said material;
• (c) positioning said stamping surface in a first orientation and contacting a portion of said material surface with said stamping surface to hold said molecular species against said material surface portion to allow said species to bind thereto;
• and
• (d) removing said stamping surface to provide said molecular species on said material surface according to said first pattern in said first orientation.