H10W 70/05
Of insulating or insulated package substrates, or of interposers, or of redistribution
Official title: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
H10W70/05 (Of insulating or insulated package substrates, or of interposers, or of redistribution) appears on 16,897 US grants and 20,418 published applications in this corpus.
Search patents in H10W- Granted patents
- 16,897
- Published applications
- 20,418
- Assignees
- 1,911
- Inventors
- 18,315
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 9 | 0 |
| 1982 | 15 | 0 |
| 1983 | 10 | 0 |
| 1984 | 13 | 0 |
| 1985 | 25 | 0 |
| 1986 | 18 | 0 |
| 1987 | 38 | 0 |
| 1988 | 33 | 0 |
| 1989 | 39 | 0 |
| 1990 | 52 | 0 |
| 1991 | 55 | 0 |
| 1992 | 77 | 0 |
| 1993 | 82 | 0 |
| 1994 | 86 | 0 |
| 1995 | 68 | 0 |
| 1996 | 86 | 0 |
| 1997 | 101 | 0 |
| 1998 | 123 | 0 |
| 1999 | 128 | 0 |
| 2000 | 130 | 0 |
| 2001 | 173 | 70 |
| 2002 | 169 | 202 |
| 2003 | 197 | 213 |
| 2004 | 176 | 308 |
| 2005 | 177 | 341 |
| 2006 | 224 | 383 |
| 2007 | 220 | 389 |
| 2008 | 238 | 448 |
| 2009 | 234 | 432 |
| 2010 | 341 | 476 |
| 2011 | 396 | 492 |
| 2012 | 415 | 548 |
| 2013 | 468 | 569 |
| 2014 | 523 | 699 |
| 2015 | 614 | 878 |
| 2016 | 845 | 980 |
| 2017 | 1022 | 1180 |
| 2018 | 1072 | 1131 |
| 2019 | 1129 | 1327 |
| 2020 | 1160 | 1480 |
| 2021 | 1053 | 1319 |
| 2022 | 1057 | 1444 |
| 2023 | 1080 | 1302 |
| 2024 | 1058 | 1518 |
| 2025 | 1038 | 1403 |
| 2026 | 600 | 886 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet6 Oct 2026US 12,757,747 B2
- Aligned via and trace formation using multi-tone phoitomasks and multi-layer photosensitive stacks6 Oct 2026US 12,757,748 B2Intel Corporation
- Manufacturing method of redistribution layer8 Oct 2026US 2026/0310094 A1Shanghai AVIC Optoelectronics Co., Ltd.
- Manufacturing method of the semiconductor package8 Oct 2026US 2026/0314301 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314430 A1SK hynix Inc.
- Optical multi-chip interconnect bridge architecture and fabrication processes8 Oct 2026US 2026/0314433 A1Sicily Merger Sub II, Inc.
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Formation of microstamped patterns on surfaces and derivative articles1,049US 5,512,131 APresident and Fellows of Harvard College · 1996
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015