H10W 70/097
Cleaning
Official title: {Cleaning}
H10W70/097 (Cleaning) appears on 180 US grants and 194 published applications in this corpus.
Search patents in H10W- Granted patents
- 180
- Published applications
- 194
- Assignees
- 89
- Inventors
- 470
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 2 |
| 2002 | 7 | 6 |
| 2003 | 5 | 4 |
| 2004 | 1 | 9 |
| 2005 | 3 | 7 |
| 2006 | 4 | 12 |
| 2007 | 3 | 4 |
| 2008 | 2 | 3 |
| 2009 | 1 | 3 |
| 2010 | 6 | 2 |
| 2011 | 0 | 1 |
| 2012 | 1 | 1 |
| 2013 | 3 | 2 |
| 2014 | 0 | 3 |
| 2015 | 3 | 7 |
| 2016 | 5 | 7 |
| 2017 | 9 | 11 |
| 2018 | 12 | 17 |
| 2019 | 10 | 13 |
| 2020 | 15 | 19 |
| 2021 | 10 | 14 |
| 2022 | 17 | 12 |
| 2023 | 6 | 7 |
| 2024 | 9 | 11 |
| 2025 | 6 | 11 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Asymmetrical dielectric-to-metal adhesion architecture for electronic packages6 Oct 2026US 12,757,760 B2Intel Corporation
- Package with solder mask1 Sep 2026US 12,727,487 B2NXP USA, Inc.
- Method for producing a package substrate including a composition for removing the photoresist7 Jul 2026US 12,677,676 B2Mitsubishi Gas Chemical Company, Inc.
- Wiring board manufacturing method and wiring board4 Nov 2025US 12,463,056 B2Toppan Inc.
- Bonding with pre-deoxide process and apparatus for performing the same4 Nov 2025US 12,463,175 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Photosensitive resin composition, cured film, electronic device, and electronic device manufacturing method17 Sep 2026US 2026/0275108 A1Sumitomo Bakelite Co., Ltd.
- Method for depositing metal conductive layer on glass substrate27 Aug 2026US 2026/0255982 A1Skytech
- Semiconductor structure including dual-side high-density substrate and manufacturing method thereof16 Jul 2026US 2026/0206627 A1
- Bonding structures formed using selective surface treatment of copper bumps and methods of forming the same30 Apr 2026US 2026/0123452 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for fabricating the same29 Jan 2026US 2026/0033345 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor218US 4,954,142 AInternational Business Machines Corporation · 1990
- Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor164US 5,084,071 AInternational Business Machines Corporation · 1992
- Photoreactive surface processing160US 5,669,979 AUVTech Systems, Inc. · 1997
- Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate87US 6,015,722 AGore Enterprise Holdings, Inc. · 2000
- Mold runner removal from a substrate-based packaged electronic device68US 5,635,671 AAmkor Electronics, Inc. · 1997