Method for producing a package substrate including a composition for removing the photoresist

A method for producing a semiconductor device having a copper wiring and a circuit pattern, the method comprising:

• forming a barrier metal layer on an insulation layer at least partially having the copper wiring;
• forming a copper layer on the barrier metal layer;
• forming a dry film resist layer on the copper layer;
• exposing the dry film resist layer;
• developing the dry film resist layer such that a resist pattern comprising a photoresist is formed;
• forming a copper plating on an opening of the resist pattern;
• forming at least one selected from the group consisting of a tin plating and a tin alloy plating onto the copper plating such that the circuit pattern is formed, wherein the circuit pattern forms a connecting terminal portion of the copper wiring, and comprises copper, and at least one selected from the group consisting of tin and a tin alloy;
• contacting the photoresist, after the circuit pattern is formed, with a composition such that the photoresist is removed;
• and
• removing an exposed copper layer after the photoresist is removed,
• wherein the composition comprises
• 2.5 to 30% by mass of an alkanolamine,
• 0.5 to 4% by mass of a quaternary ammonium hydroxide,
• 0.5 to 20% by mass of a sugar alcohol, each mass percent with respect to a total mass of the composition for removing a photoresist,
• 1.5 to 8% by mass of a polar organic solvent comprising at least one selected from the group consisting of phenyl glycol and diethylene glycol monophenyl ether, and
• 60% to 95% by mass water, and
• the composition does not substantially contain an azole compound.