Method for depositing metal conductive layer on glass substrate
AssigneeSkytech
InventorsYAO-SYUAN CHENG, KUO-JU LIU, TA-HAO KUO, CHING-LIANG YI
Life of this patent
Estimating the term…
Loading patent…
AssigneeSkytech
InventorsYAO-SYUAN CHENG, KUO-JU LIU, TA-HAO KUO, CHING-LIANG YI
Estimating the term…
This disclosure is a method for depositing a metal conductive layer on a glass substrate. Firstly, a glass substrate is cleaned, and then a titanium metal thin film is formed on the surface of the glass substrate. The titanium metal thin film is performed a surface treatment by using a reactive plasma to form an intermediate layer, wherein the intermediate layer includes a titanium oxide thin film, a titanium nitride thin film, a titanium fluoride thin film, or a titanium chloride thin film. A titanium metal conductive layer is formed on the intermediate layer of the glass substrate. The titanium metal conductive layer is connected to the glass substrate through the intermediate layer, which can increase the adhesion between the titanium metal conductive layer and the glass substrate, and is beneficial to improve the yield and reliability of subsequent packaging processes.
A method for depositing a metal conductive layer on a glass substrate, comprising:performing a cleaning process on a glass substrate;depositing a titanium metal thin film on a surface of the glass substrate;performing a surface treatment on the titanium metal thin film located on the surface of the glass substrate through a reactive plasma to transform the titanium metal thin film into an intermediate layer, wherein the reactive plasma includes an oxygen plasma, a nitrogen plasma, a fluorine plasma, or a chlorine plasma, and the intermediate layer includes a titanium oxide thin film, a titanium nitride thin film, a titanium fluoride thin film, or a titanium chloride thin film;
A method for depositing a metal conductive layer on a glass substrate, comprising:performing a cleaning process on a glass substrate;transporting the glass substrate into a deposition chamber;inputting a reactive gas into the deposition chamber, and performing a thin film deposition on the glass substrate to form an intermediate layer on a surface of the glass substrate, wherein the reactive gas includes an oxygen, a nitrogen, a fluorine, or a chlorine, and the intermediate layer includes a titanium oxide thin film, a titanium nitride thin film, a titanium fluoride thin film, or a titanium chloride thin film;
Dependencies are inferred from the claim text.