Wiring board manufacturing method and wiring board

A wiring board manufacturing method, comprising the steps of:

• a step X of bonding a glass substrate to a support;
• a step A of forming a laser-modified portion in the glass substrate and the support by applying laser light thereto from a first surface toward an opposite surface of each of the glass substrate and the support;
• a step B of forming, on the first surface of the glass substrate, a first surface wiring layer including a hydrofluoric acid resistant metal film and a copper layer;
• a step Y of separating and removing the support;
• a step C of etching a surface of the glass substrate opposite to the first surface to form a through via in the laser-modified portion and form a second surface of the glass substrate, the second surface being an opposite surface to the first surface;
• a through via treatment step D of removing an etching residue of glass adhered to the hydrofluoric acid resistant metal film;
• and
• a step E of forming a through electrode in the through via.

A wiring board, comprising:

• a first surface wiring layer including a hydrofluoric acid resistant metal film and a copper layer, the hydrofluoric acid resistant metal film and the copper layer being formed on a first surface of a glass substrate;
• a second surface wiring layer formed on a second surface of the glass substrate, the second surface being an opposite surface to the first surface;
• a through via connecting the first surface and the second surface and extending to the hydrofluoric acid resistant metal film;
• and
• a through electrode formed in the through via and connecting the first surface wiring layer and the second surface wiring layer, wherein
• the hydrofluoric acid resistant metal film is etched from the through via perpendicularly to the first surface or etched from the through via so as to include an undercut.