Package with solder mask
AssigneeNXP USA, Inc.
InventorsAznita Abdul Aziz, Nor Azhan Bin Mahmood
Life of this patent
Estimating the term…
Abstract
An electronic device package may include a solder mask that is positioned to mitigate leakage of resin or other adhesive material from the region of a die and die bond pad onto other surfaces of the package, such as surfaces of wire bond pads. One or more wire bond pads of the package may be formed from the same conductive layer as the die bond pad, and the solder mask may be positioned over a portions of the conductive layer located directly between such wire bond pads and the die bond pad. The solder mask may include portions disposed at one or more sides of the die bond pad. The solder mask may be formed over the package substrate prior to attachment of the die to the die bond pad.
Claims13
An electronic device package comprising:
- a package substrate;
- a metal layer disposed on the package substrate, the metal layer comprising:
- a die bond pad;
- at least one wire bond pad;
- and
- a metal region connected between the die bond pad and the at least one wire bond pad;
- and
- a solder mask disposed over the package substrate, wherein a first portion of the solder mask is disposed directly on the metal region of the metal layer.
A package comprising:
- a package substrate;
- a metal layer formed on the package substrate, wherein the metal layer includes:
- a die bond pad disposed on the package substrate;
- at least one wire bond pad disposed on the package substrate and coupled to the die bond pad;
- and
- a metal region that electrically connects the die bond pad to the at least one wire bond pad;
- and
- a solder mask having a first portion disposed between a first surface of the die bond pad and a second surface of the at least one wire bond pad, wherein the solder mask is positioned to block leakage of adhesive material from the first surface of die bond pad to the second surface of the at least one wire bond pad, and the first portion of the solder mask is disposed directly on a top surface of the metal region.
Dependencies are inferred from the claim text.