H10W 70/092
Adapting interconnections
Official title: {Adapting interconnections, e.g. making engineering changes, repairing}
H10W70/092 (Adapting interconnections) appears on 308 US grants and 292 published applications in this corpus.
Search patents in H10W- Granted patents
- 308
- Published applications
- 292
- Assignees
- 141
- Inventors
- 753
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 9 | 0 |
| 1997 | 3 | 0 |
| 1998 | 11 | 0 |
| 1999 | 7 | 0 |
| 2000 | 10 | 0 |
| 2001 | 8 | 2 |
| 2002 | 4 | 9 |
| 2003 | 9 | 3 |
| 2004 | 2 | 8 |
| 2005 | 8 | 15 |
| 2006 | 9 | 20 |
| 2007 | 8 | 13 |
| 2008 | 6 | 6 |
| 2009 | 7 | 3 |
| 2010 | 7 | 5 |
| 2011 | 5 | 2 |
| 2012 | 7 | 2 |
| 2013 | 0 | 4 |
| 2014 | 5 | 6 |
| 2015 | 6 | 11 |
| 2016 | 11 | 12 |
| 2017 | 19 | 23 |
| 2018 | 24 | 21 |
| 2019 | 21 | 22 |
| 2020 | 17 | 17 |
| 2021 | 12 | 10 |
| 2022 | 12 | 17 |
| 2023 | 7 | 16 |
| 2024 | 12 | 11 |
| 2025 | 15 | 21 |
| 2026 | 4 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices and methods of manufacturing electronic devices8 Sep 2026US 12,733,559 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor chip package having internal I/O structures with modulated thickness to compensate for die/substrate warpage21 Jul 2026US 12,690,483 B2Intel Corporation
- Packaging device including bumps and method of manufacturing the same3 Mar 2026US 12,568,829 B2SK hynic Inc.
- Lot of devices with repairable redistribution layer (RDL) design with a custom RDL6 Jan 2026US 12,519,053 B2Deca Technologies USA, Inc.
- Device having solder bump structure for improved mechanical, electrical, and/or thermal performance2 Dec 2025US 12,489,042 B2Avago Technologies International Sales Pte. Limited
- Chiplet-based optical wafer-scale network switch30 Jul 2026US 2026/0219465 A1Volantis Semiconductor, Inc.
- High density die to die interconnect shift correction for overlay alignment30 Jul 2026US 2026/0223644 A1APPLIED Materials.Inc.
- Wafer-scale integration power delivery with an isotropic conductive adhesive30 Jul 2026US 2026/0223754 A1Volantis Semiconductor, Inc.
- Packaging device including bumps and method of manufacturing the same7 May 2026US 2026/0130232 A1SK hynix Inc.
- Electronic device and manufacturing method thereof30 Apr 2026US 2026/0123450 A1Innolux Corporation
Most cited
By later US patents
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016
- Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip182US 8,679,861 B2International Business Machines Corporation · 2014
- Reworkable high density interconnect structure incorporating a release layer168US 5,434,751 AMartin Marietta Corporation · 1995
- Inverted chip bonded module with high packaging efficiency130US 5,627,406 A1997
- Method of manufacturing a repairable multi-chip module121US 5,137,836 AAtmel Corporation · 1992