Lot of devices with repairable redistribution layer (RDL) design with a custom RDL
AssigneeDeca Technologies USA, Inc.
InventorsCraig Bishop, David Ryan Bartling, Timothy L. Olson
Life of this patent
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Abstract
The disclosure concerns methods of forming a semiconductor device with a repairable redistribution layer (RDL) design, comprising: preparing an original repairable RDL design; forming first conductive segments of the repairable RDL design; inspecting the first conductive segments of the repairable RDL design to detect manufacturing defects; detecting at least one defect in the first conductive segments; and forming second conductive segments of the repairable RDL design according to a new custom RDL design to mitigate the negative effects of the at least one defect among the first conductive segments. The disclosure also concerns semiconductor devices with a repairable RDL design.
Claims21
A repairable redistribution layer (RDL) comprising an original, repairable RDL formed over one or more semiconductor devices, comprising:
- a first portion of the original, repairable RDL comprising first conductive segments coupled to the one or more semiconductor devices and electrically unconnected to each other;
- a second portion of the original, repairable RDL comprising an RDL design for second conductive segments that is different from first portion of the original, repairable RDL;
- a manufacturing defect in the first conductive segments, wherein the manufacturing defect and the first conductive segments are physically unaltered by laser ablation or by material removal;
- and
- second conductive segments comprising a new, custom RDL differing from the RDL design of the second portion of the original, repairable RDL, coupled to the one or more semiconductor devices and configured to repair the manufacturing defect in the first conductive segments, wherein the second conductive segments are electrically connected to the first conductive segments and provide RDL rerouting around the manufacturing defect of the first conductive segments.
A lot of devices with repairable redistribution layer (RDL) designs, comprising:
- an original repairable RDL design formed within each of the devices of the lot, wherein the original repairable RDL design comprises first conductive segments;
- a first device of the lot that comprises no manufacturing defects within the first conductive segments;
- a second device of the lot that comprises at least one manufacturing defect within the first conductive segments;
- and
- second conductive segments of the repairable RDL design for the first device that are different from the second conductive segments of the second device, wherein the second conductive segments of the second device are made according to a new custom RDL design to mitigate negative effects of the at least one manufacturing defect within the first conductive segments.
A repairable redistribution layer (RDL) formed over a semiconductor device, comprising:
- first conductive segments formed vertically above and electrically coupled to the semiconductor device through a first set of conductive interconnects and comprising a first RDL design;
- a manufacturing defect formed contacting a part of the first conductive segments;
- and
- second conductive segments, formed as part of the RDL and according to a second RDL design, different from the first RDL design of the first conductive segments, first and second ends of the second conductive segments being electrically coupled to the semiconductor device through a second set of conductive interconnects, separate from the first set of conductive interconnects, the second conductive segments being configured to repair the manufacturing defect in the first conductive segments, wherein the second conductive segments provide RDL rerouting around the manufacturing defect of the first conductive segments such that the manufacturing defect and the first conductive segments are physically unaltered.
Dependencies are inferred from the claim text.