Method of manufacturing a repairable multi-chip module

A method of manufacturing a repairable multi-chip module comprising,

• securing a plurality of integrated circuit chips to a plurality of substrates by heating a first bonding material above the melting temperature of said first bonding material, each chip being electrically connected to a tape automated bonding frame,
• providing a second bonding material between said substrates and a multi-chip module for mechanically attaching said substrates to said module, said providing said second bonding material being a providing of a material having a melting temperature below the melting temperature of said first bonding material,
• electrically coupling said plurality of chips to said module, said electrical coupling including connecting leads of said tape automated bonding frame to contacts on said module, and
• mechanically coupling said substrates to said module, said mechanical coupling including heating said second bonding material above the melting temperature of said second bonding material but below the melting temperature of said first bonding material.

A method of repairing a multi-chip module comprising,

• fixing a plurality of integrated circuit chips to a plurality of substrates by heat treating a first bonding material having a first melting temperature,
• electrically attaching said plurality of substrates to a multi-chip module,
• removing a defective chip of said plurality of chips from said module by electrically detaching said defective chip,
• inserting a replacement chip attached to a replacement substrate in a position previously maintained by said defective chip,
• electrically attaching said replacement chip to said module, and
• heating a second bonding material to a temperature less than said first melting temperature to secure said replacement substrate and said plurality of substrates to said module.