Wafer-scale integration power delivery with an isotropic conductive adhesive

An apparatus for power delivery comprising:

• a wafer-scale integration (WSI) system, wherein the WSI system includes a plurality of functional chips;
• a plurality of isotropic conductive adhesives (ICAs), wherein the plurality of ICAs couple the WSI system to a plurality of power modules;
• and
• one or more voltage converters, wherein the voltage converters perform at least one voltage conversion and send DC power to the plurality of functional chips.

A system for power delivery comprising:

• a wafer-scale integration (WSI) system, wherein the WSI system includes a plurality of functional chips;
• a plurality of isotropic conductive adhesives (ICAs), wherein the plurality of ICAs couple the WSI system to a plurality of power modules;
• and
• one or more voltage converters, wherein the system, when provided DC power, is configured to:
• send DC power to the plurality of functional chips, wherein the sending includes one or more voltage conversions.