Electronic device and manufacturing method thereof

Abstract

An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes: providing a substrate; performing a hole-forming process on the substrate to form a through hole in the substrate; performing a first inspection step to the substrate to obtain a first inspection result; and determining whether a condition of the through hole is abnormal based on the first inspection result. A through hole rework process is performed on the substrate when the condition of the through hole is determined to be abnormal, and the through hole rework process includes performing a rework direction determining step to determine whether the substrate needs to be flipped during performing the through hole rework process.

Dependencies are inferred from the claim text.