Electronic devices and methods of manufacturing electronic devices
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsGi Tae Lim, Wook Choi, Seul Bee Lee
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AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsGi Tae Lim, Wook Choi, Seul Bee Lee
Estimating the term…
In one example, an electronic device can comprise a first substrate, an electronic component disposed over a side of the first substrate, and a vertical interconnect coupled to the side of the first substrate. The vertical interconnect can comprise a first metallic core ball proximate the first substrate, a second metallic core ball disposed above the first metallic core ball and distal from the first substrate, and a fusible material coupling the first metallic core ball with the second metallic core ball. The fusible material can be coupled to the first substrate. A second substrate can be disposed over the electronic component and the vertical interconnect. The fusible material of the vertical interconnect can be coupled to the second substrate. Other examples and related methods are also disclosed herein.
An electronic device, comprising:
An electronic device comprising:
A method of making an electronic device, comprising:
Dependencies are inferred from the claim text.