Package substrate with open air gap structures

A package substrate, comprising:

• an organic dielectric material;
• a conductive trace in the organic dielectric material;
• a first air gap structure;
• and
• a second air gap structure laterally parallel to the first air gap structure,
• wherein:
• the conductive trace is proximate and parallel to a surface of the package substrate,
• the conductive trace is between the first air gap structure and the second air gap structure,
• the first air gap structure and the second air gap structure are exposed on the surface of the package substrate,
• the first air gap structure and the second air gap structure extend orthogonal to the surface of package substrate into the organic dielectric material, and
• the first air gap structure and the second air gap structure comprise a plurality of open blind vias arranged in respective rows parallel to the conductive trace and extending along a length of the conductive trace.

A package substrate, comprising:

• an organic dielectric material;
• a conductive trace in the organic dielectric material;
• a first air gap structure;
• and
• a second air gap structure laterally parallel to the first air gap structure,
• wherein:
• the conductive trace is proximate and parallel to a surface of the package substrate,
• the conductive trace is between the first air gap structure and the second air gap structure,
• the first air gap structure and the second air gap structure are exposed on the surface of the package substrate,
• the first air gap structure and the second air gap structure extend orthogonal to the surface of package substrate into the organic dielectric material, and
• at least some surfaces of the first air gap structure and the second air gap structure are covered by a passivation layer of a compound comprising silicon and nitrogen.

A package substrate, comprising:

• an organic dielectric material;
• a conductive trace in the organic dielectric material;
• a first air gap structure;
• and
• a second air gap structure laterally parallel to the first air gap structure,
• wherein:
• the conductive trace is proximate and parallel to a surface of the package substrate,
• the conductive trace is between the first air gap structure and the second air gap structure,
• the first air gap structure and the second air gap structure are exposed on the surface of the package substrate,
• the first air gap structure and the second air gap structure extend orthogonal to the surface of package substrate into the organic dielectric material,
• the package substrate further comprises a ground plane, and
• the conductive trace is configured as a microstrip, the conductive trace being more proximate to the surface of the package substrate than the ground plane.

A package substrate, comprising:

• an organic dielectric material;
• a conductive trace in the organic dielectric material;
• a first air gap structure;
• and
• a second air gap structure laterally parallel to the first air gap structure,
• wherein:
• the conductive trace is proximate and parallel to a surface of the package substrate,
• the conductive trace is between the first air gap structure and the second air gap structure,
• the first air gap structure and the second air gap structure are exposed on the surface of the package substrate,
• the first air gap structure and the second air gap structure extend orthogonal to the surface of package substrate into the organic dielectric material,
• the conductive trace is a first conductive trace, and
• the package substrate further comprises:
• a second conductive trace in the organic dielectric material, the second conductive trace being laterally adjacent and parallel to the first conductive trace;
• and
• a third air gap structure laterally parallel to the first air gap structure and the second air gap structure,
• the second conductive trace is proximate and parallel to a surface of the package substrate,
• the second conductive trace is between the second air gap structure and the third air gap structure,
• the third air gap structure is exposed on the surface of the package substrate, and
• the third air gap structure extends orthogonal to the surface of package substrate into the organic dielectric material.

A package substrate, comprising:

• an organic dielectric material;
• a conductive bond-pad on a surface of the package substrate;
• and
• an air gap structure surrounding the conductive bond-pad,
• wherein:
• the air gap structure is exposed on the surface of the package substrate,
• the air gap structure extends orthogonal to the surface of package substrate into the organic dielectric material,
• the conductive bond-pad is among a first subset of a plurality of conductive bond-pads,
• the first subset of the plurality of conductive bond-pads is conductively coupled to a signal connection, and
• a second subset of the plurality of conductive bond-pads is conductively coupled to a ground connection.