H10W 70/06
Using temporary auxiliary supports
Official title: using temporary auxiliary supports
H10W70/06 (Using temporary auxiliary supports) appears on 3 US grants and 25 published applications in this corpus.
Search patents in H10W- Granted patents
- 3
- Published applications
- 25
- Assignees
- 14
- Inventors
- 47
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2021 | 0 | 1 |
| 2022 | 1 | 2 |
| 2023 | 0 | 0 |
| 2024 | 1 | 3 |
| 2025 | 0 | 5 |
| 2026 | 1 | 14 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of fabricating package structure1 Sep 2026US 12,727,522 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method of fabricating the same3 Sep 2024US 12,080,681 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method of fabricating the same23 Aug 2022US 11,424,219 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating interposer, method for fabricating chip, interposer, chip and chip package17 Sep 2026US 2026/0282940 A1Beijing Huafeng Integrated Electronics Co., LTD.
- Method for Forming an Interconnect Structure17 Sep 2026US 2026/0282941 A1
- Board apparatus, electronic apparatus, electronic device, method for manufacturing electronic apparatus, and method for manufacturing electronic device10 Sep 2026US 2026/0271761 A1Sony Semiconductor Solutions Corporation
- A system-in-package structure and method for manufacturing same3 Sep 2026US 2026/0262552 A1SJ Semiconductor(Jiangyin) Corporation
- Multi-chip module and method for manufacturing thereof27 Aug 2026US 2026/0255993 A1Inpack Technologies - Limited Partnership
Most cited
By later US patents