Multi-chip module and method for manufacturing thereof
AssigneeInpack Technologies - Limited Partnership
InventorJoseph KAPLUN
Life of this patent
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Abstract
Disclosed herein is a multi-chip module having an open/exposed/bare backside including a heat sink, the heat sink configured for heat dissipation from the multi-chip module, one or more electronic components, and a front side comprising a coreless interposer including: a plurality of layers, wherein each of the plurality of layers includes a plurality of conducting lines/pads and one or more gaps between the plurality of conducting lines/pads, wherein the one or more gaps are filled with an insulating material, and wherein the one or more electronic components are positioned between the coreless interposer and the heat sink, and wherein the front side is configured for electrical communication with external electrical components.
Claims20
A multi-chip module comprising:
- an open/exposed/bare backside comprising a heat sink, the heat sink configured for heat dissipation from the multi-chip module;
- one or more electronic components;
- and
- a front side comprising a coreless interposer comprising:
- a plurality of layers, wherein each of the plurality of layers comprises a plurality of conducting lines/pads;
- and
- one or more gaps between the plurality of conducting lines/pads, wherein the one or more gaps are filled with an insulating material;
- and
- wherein the one or more electronic components are positioned between the coreless interposer and the heat sink;
- and
- wherein the front side is configured for electrical communication with external electrical components.
A method for manufacturing a multi-chip module, the method comprising:
- positioning one or more electronic components on an inert carrier, wherein the carrier comprises a coating capable of controlled detachment therefrom;
- coating/covering the one or more electronic components with a molding material, such that the one or more electronic components are covered by the molding material and wherein a space between the one or more electronic components is filled with the molding material, thereby obtaining a molded multi-component structure;
- grinding the multi-component structure until a backside of all of the one or more electronic components in the multi-component structure is exposed;
- attaching a heat sink to the exposed backside, such that a front side of the molded multi-component structure faces the carrier and the backside of the multi-component structure faces the heat sink;
- and
- building up a coreless interposer on the front side of the multi-component structure.
Dependencies are inferred from the claim text.