H10W 70/098
Applying pastes or inks
Official title: {Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)}
H10W70/098 (Applying pastes or inks) appears on 682 US grants and 610 published applications in this corpus.
Search patents in H10W- Granted patents
- 682
- Published applications
- 610
- Assignees
- 334
- Inventors
- 1,599
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 6 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 8 | 0 |
| 1986 | 3 | 0 |
| 1987 | 9 | 0 |
| 1988 | 9 | 0 |
| 1989 | 11 | 0 |
| 1990 | 10 | 0 |
| 1991 | 10 | 0 |
| 1992 | 7 | 0 |
| 1993 | 15 | 0 |
| 1994 | 11 | 0 |
| 1995 | 10 | 0 |
| 1996 | 22 | 0 |
| 1997 | 12 | 0 |
| 1998 | 20 | 0 |
| 1999 | 21 | 0 |
| 2000 | 18 | 0 |
| 2001 | 18 | 8 |
| 2002 | 9 | 17 |
| 2003 | 11 | 16 |
| 2004 | 12 | 22 |
| 2005 | 13 | 29 |
| 2006 | 14 | 21 |
| 2007 | 11 | 16 |
| 2008 | 14 | 16 |
| 2009 | 11 | 14 |
| 2010 | 14 | 27 |
| 2011 | 11 | 13 |
| 2012 | 10 | 13 |
| 2013 | 16 | 15 |
| 2014 | 14 | 24 |
| 2015 | 17 | 32 |
| 2016 | 24 | 26 |
| 2017 | 25 | 43 |
| 2018 | 36 | 46 |
| 2019 | 36 | 47 |
| 2020 | 46 | 29 |
| 2021 | 23 | 27 |
| 2022 | 23 | 32 |
| 2023 | 19 | 16 |
| 2024 | 17 | 23 |
| 2025 | 15 | 27 |
| 2026 | 8 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ball grid array assembly using a solder paste mix and method of using a solder paste dip11 Aug 2026US 12,707,987 B1Frontgrade Technologies Inc.
- Electronic package with concave lead end faces11 Aug 2026US 12,708,008 B2Texas Instruments Incorporated
- Semiconductor package with flip chip solder joint capsules28 Jul 2026US 12,696,771 B2Texas Instruments Incorporated
- Solder reflow apparatus and method of manufacturing electronic device2 Jun 2026US 12,648,453 B2Samsung Electronics Co., Ltd.
- Thick film printed cooler for improved thermal management of direct bonded power devices7 Apr 2026US 12,598,693 B2Dana Canada Corporation
- Solder reflow apparatus and method of manufacturing electronic device17 Sep 2026US 2026/0282943 A1Samsung Electronics Co., Ltd.
- Chiplet-based optical wafer-scale network switch30 Jul 2026US 2026/0219465 A1Volantis Semiconductor, Inc.
- Wafer-scale integration power delivery with an isotropic conductive adhesive30 Jul 2026US 2026/0223754 A1Volantis Semiconductor, Inc.
- Glass via filling16 Jul 2026US 2026/0206620 A1
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene-Coated Interconnects11 Jun 2026US 2026/0165167 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Formation of microstamped patterns on surfaces and derivative articles1,049US 5,512,131 APresident and Fellows of Harvard College · 1996
- Microcontact printing on surfaces and derivative articles267US 6,180,239 B2President and Fellows of Harvard College · 2001
- Methods of etching articles via microcontact printing243US 5,900,160 APresident and Fellows of Harvard College · 1999
- Stretchable and foldable electronic devices220US 8,552,299 B2The Board of Trustees of the University of Illinois · 2013
- Flip chip technology using electrically conductive polymers and dielectrics219US 5,074,947 AEpoxy Technology, Inc. · 1991