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US 12,707,987 B1Granted
Ball grid array assembly using a solder paste mix and method of using a solder paste dip
AssigneeFrontgrade Technologies Inc.
InventorsScott Popelar, Julie Hook, Sean Brinlee
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a ball grid array (BGA) assembly is disclosed. An example method may include coating at least a portion of each solder ball of a BGA in a solder paste mix. The method may further include mounting the BGA onto a secondary board to form the BGA assembly, wherein mounting the BGA on the secondary board comprises mounting each solder ball coated with the solder paste mix to the secondary board.
Claims20
A method for manufacturing a ball grid array (BGA) assembly, the method comprising:
- coating at least a portion of each solder ball of a BGA in a solder paste mix, wherein the BGA comprises a plurality of solder balls, and wherein the solder paste mix comprises solder paste, wherein coating at least the portion of each solder ball of the BGA in the solder paste mix comprises applying an application force to the BGA when lowered into the solder paste mix and the BGA is at least one of rotated, swirled, vibrated, and perturbed to increase solder paste mix coverage on the plurality of solder balls;
- and
- mounting the plurality of solder balls onto a secondary board to form the BGA assembly, wherein mounting the plurality of solder balls onto the secondary board comprises mounting each solder ball coated with the solder paste mix to the secondary board, wherein the secondary board comprises a plurality of landing pads, wherein the plurality of solder balls coated with the solder paste mix are mounted to the plurality of landing pads, and wherein the landing pads are absent of the solder paste mix before the solder balls coated with the solder paste mix are mounted to the plurality of landing pads.
Dependencies are inferred from the claim text.