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US 2026/0165167 A1Published application
Semiconductor Device and Method of Making a Semiconductor Package with Graphene-Coated Interconnects
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsYongMoo Shin, HeeSoo Lee, EunHee Myung
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Abstract
A semiconductor device includes a first substrate and a second substrate. A graphene-coated interconnect is disposed between the first substrate and second substrate. A semiconductor die is disposed between the first substrate and second substrate. The first substrate is electrically coupled to the second substrate through the graphene-coated interconnect. An encapsulant is deposited between the first substrate and second substrate.
Claims25
A semiconductor device, comprising:
- a first substrate;
- a semiconductor die disposed over the first substrate;
- a graphene-coated interconnect disposed over the first substrate, wherein the graphene-coated interconnect includes,
- a copper core,
- a polymer coating formed on the copper core,
- a graphene coating formed on the polymer coating, and
- a solder coating formed on the graphene coating;
- and
- a second substrate disposed over the first substrate with the semiconductor die and graphene-coated interconnect between the first substrate and second substrate.
6 more elements
A semiconductor device, comprising:
- a substrate;
- a graphene-coated interconnect disposed over the substrate, wherein the graphene-coated interconnect includes,
- a copper core,
- a polymer coating formed on the copper core,
- a graphene coating formed on the polymer coating, and
- a solder coating formed on the graphene coating;
- and
- a semiconductor die disposed over the substrate.
5 more elements
A semiconductor device, comprising:
- a first substrate and a second substrate;
- a graphene-coated interconnect disposed between the first substrate and second substrate, wherein the graphene-coated interconnect includes,
- a copper core,
- a graphene coating formed on the copper core, and
- a solder coating formed on the graphene coating;
- and
- a semiconductor die disposed between the first substrate and second substrate.
4 more elements
A semiconductor device, comprising:
- a substrate;
- a graphene-coated interconnect disposed over the substrate, wherein the graphene-coated interconnect includes,
- a copper core,
- a graphene coating formed on the copper core, and
- a solder coating formed on the graphene coating;
- a solder disposed between the substrate and the graphene-coated interconnect;
- and
- a semiconductor die disposed over the substrate.
5 more elements
Dependencies are inferred from the claim text.