Semiconductor package with flip chip solder joint capsules
AssigneeTexas Instruments Incorporated
InventorsJames Raymond Maliclic Baello, Steffany Ann Lacierda Moreno
Life of this patent
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Abstract
A semiconductor package includes a leadframe forming a plurality of leads with a die attach site, a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints, a set of solder joint capsules covering each of the set of solder joints against the leadframe, a clip mounted to the leadframe over the semiconductor die with a clip solder joint. The solder joint capsules restrict flow of the solder joints of the semiconductor die contacts in the flip chip configuration such that the solder remains in place if remelted during later clip solder reflow.
Claims22
A semiconductor package comprising:
- a sensor coil coupling a first lead to a second lead;
- a plurality of leads other than the first and second leads;
- a semiconductor die including a set of die contacts electrically connected to respective ones of the plurality of leads other than the first and second leads in a flip chip configuration, the semiconductor die extending over the sensor coil;
- and
- a clip soldered to the first and second leads, the clip extending over only a portion of, and not electrically connected to, the semiconductor die.
A semiconductor package comprising:
- a leadframe forming a plurality of leads with a die attach site;
- a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of joints formed from solder having a first melting temperature;
- a set of solder joint capsules covering each of the set of solder joints;
- and
- a clip mounted to the leadframe over the semiconductor die with a clip solder joint formed from solder having a second melting temperature higher than the first melting temperature.
A semiconductor package comprising:
- a leadframe forming a plurality of leads with a die attach site, wherein the plurality of leads includes sensor coil leads and a plurality of die leads, and wherein the leadframe includes a first sensor coil between the sensor coil leads;
- a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints;
- a set of solder joint capsules covering each of the set of solder joints against the leadframe;
- and
- a clip mounted to the leadframe over the semiconductor die with a clip solder joint, wherein the clip includes a second sensor coil, the second sensor coil forming a parallel conductive path with the first sensor coil via the clip solder joint;
- wherein the plurality of die leads are physically and electrically separated from the first sensor coil and the second sensor coil;
- wherein the semiconductor die is positioned between the first sensor coil and the second sensor coil with a first gap separating the semiconductor die from the first sensor coil and a second gap separating the semiconductor die from the second sensor coil;
- and
- wherein the semiconductor die includes a sensor operable to detect magnetic fields created by electrical current through the first sensor coil and the second sensor coil, the semiconductor die operable to output a signal representative of the detected magnetic fields via the die leads.
A semiconductor package comprising:
- a sensor coil between sensor coil leads;
- a plurality of leads spaced from the sensor coil leads;
- a semiconductor die including a set of die contacts mounted to the plurality of leads spaced from the sensor coil leads in a flip chip configuration with each die contact of the set of die contacts electrically connected to one of the plurality of leads spaced from the sensor coil leads via a solder joint, the semiconductor die extending over the sensor coil;
- and
- a clip soldered to at least one of the sensor coil leads, the clip extending over only a portion of, and not electrically connected to, the semiconductor die.
Dependencies are inferred from the claim text.