Solder reflow apparatus and method of manufacturing electronic device

A method of manufacturing an electronic device, the method comprising:

• providing a substrate including a plurality of bonding pads on a first surface of the substrate;
• attaching solder members on respective ones of the plurality of bonding pads;
• positioning an airflow control cover on the first surface of the substrate above the solder members, the airflow control cover including a plurality of vapor passage holes through which air is allowed to flow toward the solder members;
• loading the substrate on which the airflow control cover is positioned into a vapor generating chamber that accommodates a heat transfer fluid therein;
• heating the heat transfer fluid to place the heat transfer fluid in a vapor state within the chamber;
• and
• soldering the solder members by supplying the heat transfer fluid in the vapor state to surfaces of the solder members through the plurality of the vapor passage holes of the airflow control cover.

A method of manufacturing an electronic device, the method comprising:

• providing a substrate including a plurality of bonding pads on a first surface of the substrate;
• coating a solder paste on the plurality of bonding pads;
• attaching solder members on the plurality of bonding pads respectively;
• positioning an airflow control cover on the first surface of the substrate above the solder members, the airflow control cover including a plurality of vapor passage holes through which air is allowed to flow toward the solder members;
• loading the substrate on which the airflow control cover is positioned into a vapor generating chamber that accommodates a first heat transfer fluid therein;
• heating the first heat transfer fluid to create a second heat transfer fluid in a vapor state within the chamber;
• and
• soldering the solder members by supplying the second heat transfer fluid in the vapor state to surfaces of the solder members through the plurality of the vapor passage holes of the airflow control cover.