Thick film printed cooler for improved thermal management of direct bonded power devices

A cooler assembly, comprising;

• a heat exchanger having a heat exchanger surface that physically couples at least an electrical section comprised of:
• a dielectric layer of dielectric material;
• a conductor layer of thermally and electrically conducting material that is compatible with metallurgic bonding;
• a bulk metal layer that is compatible with metallurgic bonding;
• and
• an electrical component;
• wherein, the dielectric layer is physically coupled to the heat exchanger surface, and wherein the conductor layer, the bulk metal layer, and the electrical component are coupled to an exposed surface of the dielectric layer such that the conductor layer is sandwiched between the bulk metal layer and the dielectric layer.

A method of assembling an electrical section to a cooler assembly, comprising:

• applying a dielectric layer via paste printing to a heat exchanger surface;
• firing and/or curing the dielectric layer;
• applying a conductor layer via paste printing on an exposed surface of the dielectric layer;
• firing and/or curing the conductor layer;
• physically and electrically coupling a bulk metal layer to the conductor layer via metallurgic bonding;
• and
• physically and electrically coupling an electronic component to the bulk metal layer via metallurgic bonding.

A cooler assembly, comprising:

• a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto,
• wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer;
• and
• at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component,
• wherein a conductor layer comprising thermally and electrically conductive material compatible with metallurgic bonding is physically coupled to the exposed surface of the dielectric layer, such that the dielectric layer is sandwiched between the conductor layer and the heat exchanger surface,
• wherein a bulk metal layer is physically and electrically coupled to the conductor layer via metallurgic bonding, such that the conductor layer is sandwiched between the bulk metal layer and the dielectric layer,
• wherein an electrical component or a plurality of electrical components are physically and electrically coupled to the bulk metal layer via metallurgic bonding, such that the bulk metal layer is sandwiched between the electrical component or electrical components and the conductor layer, and
• wherein the heat exchanger surface has a plurality of dielectric layers comprising the dielectric layer, wherein the dielectric layers are patterned into a series of pads that are electrically isolated from one another.