Solder reflow apparatus and method of manufacturing electronic device
AssigneeSamsung Electronics Co., Ltd.
InventorsYoungja Kim, Minwoo Jeon
Life of this patent
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Abstract
A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated, a heater configured to heat the heat transfer fluid accommodated within the vapor generating chamber, a substrate stage installed to be movable upward and downward in the vapor generating chamber, the substrate stage having a seating surface on which a substrate on which solder members are attached is seated, and an airflow control cover disposed on the substrate stage above the solder members, the airflow control cover including a plurality of vapor passage holes through which air is allowed to flow toward the solder members.
Claims20
A solder reflow apparatus, comprising:
- a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated;
- a heater configured to heat the heat transfer fluid accommodated within the vapor generating chamber;
- a substrate stage installed to be movable upward and downward in the vapor generating chamber, the substrate stage having a seating surface on which a substrate on which solder members are attached is seated;
- and
- an airflow control cover disposed on the substrate stage above the solder members, the airflow control cover including a plurality of vapor passage holes through which air is allowed to flow toward the solder members.
A solder reflow apparatus, comprising:
- a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid;
- a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber;
- a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage comprising a seating surface on which a substrate on which solder members are attached is seated;
- an airflow control cover including a cover plate extending parallel to a surface of the substrate above the solder members and a support portion to support the cover plate such that the cover plate and the support portion form an enclosed or partially enclosed space where a desired airflow is generated;
- and
- a plurality of vapor passage holes penetrating the cover plate and configured to allow the saturated vapor to move through the cover plate.
A solder reflow apparatus, comprising:
- a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated;
- a heater configured to heat the heat transfer fluid accommodated within the vapor generating chamber;
- a substrate stage installed to be movable upward and downward in the vapor generating chamber, the substrate stage having a seating surface on which a substrate on which solder members are attached is seated;
- a fixing jig supported on the seating surface of the substrate stage and configured to fix the substrate;
- and
- an airflow control cover include a cover plate extending parallel to a surface of the substrate above the solder members and a support portion extending from the fixing jig to support the cover plate, the cover plate including a plurality of vapor passage holes through which air is allowed to flow toward the solder members.
Dependencies are inferred from the claim text.