H10W 70/096
Cutting or separating
Official title: {Cutting or separating}
H10W70/096 (Cutting or separating) appears on 5 US grants and 22 published applications in this corpus.
Search patents in H10W- Granted patents
- 5
- Published applications
- 22
- Assignees
- 13
- Inventors
- 56
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 0 | 2 |
| 2024 | 1 | 3 |
| 2025 | 1 | 4 |
| 2026 | 2 | 11 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of fabricating package structure1 Sep 2026US 12,727,522 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device11 Aug 2026US 12,707,771 B2ams-OSRAM International GmbH
- Substrate-based package semiconductor device with side wettable flanks18 Nov 2025US 12,476,220 B2Nexperia B. V.
- Package structure and method of fabricating the same3 Sep 2024US 12,080,681 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method of fabricating the same23 Aug 2022US 11,424,219 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and a method for forming the same17 Sep 2026US 2026/0282932 A1JCET STATS ChipPAC Korea Limited
- Method for fabricating interposer, method for fabricating chip, interposer, chip and chip package17 Sep 2026US 2026/0282940 A1Beijing Huafeng Integrated Electronics Co., LTD.
- Photosensitive composition, transfer film, method for manufacturing laminate, laminate, and semiconductor package27 Aug 2026US 2026/0256003 A1FUJIFILM Corporation
- Semiconductor device manufacturing method, structure, and semiconductor device20 Aug 2026US 2026/0247991 A1Resonac Corporation
- Cutting apparatus, cutting method, and method for manufacturing cut product30 Jul 2026US 2026/0216919 A1Towa Corporation
Most cited
By later US patents